In this paper we focus on the properties of materials and components and their optimal selection. With proposed materials and components, some modifications of technology processes of the power module construction were put in effect. With the proposed materials, components and a new power module design the price/performance ratio achieved was 1.6 times higher compared to the state-of-the-art power module realizations currently available.
COBISS.SI-ID: 8145492
The paper focuses on an ASIC design for power MOSFET driver with an intelligent current driving technique which optimizes the performance and efficiency of driving connected power MOSFET. The design of the ASIC power MOSFET driver includes the implementation of gate MOSFET driving algorithm and some safety functions. The introduced mixed-signal ASIC is used as a single chip solution which increases the overall system reliability and reduces circuit complexity and optimizes the costs.
COBISS.SI-ID: 9249620
To optimise the performance of the power module a special attention also to current path optimisation should be paid. The article presents simulation model and simulation results for various shaped metal conductor during hard switching events which occur within power module (skin effect). There is a close connection with research project.
COBISS.SI-ID: 8719700
The electrical device or system, which does not employ at least one semiconductor power device, such as power MOSFET, IGBT transistor or other, can only rarely be found. The focus of this paper is on a new concept of intelligent power driving technique. This paper will also present some possibilities of implementing a driving technique as part of an integrated system realized on silicon.
COBISS.SI-ID: 7934036
The patent presents an improved construction of power module for switching high power electrical loads with semiconductor power devices. To the prior art power module designs the new innovative design propose electrical, thermal and mechanical power module properties optimization. The power module structure consists of three construction parts: a base plate, a top plate and a three dimensionally structured interconnection network.
COBISS.SI-ID: 6365268